LeTV, the Chinese smartphone brand quickly become known to the market with the release of its Le Max, a Snapdragon 810 powered smartphone with an enormous 6.33 inch screen size and other impressive hardware. Now, the company is looking to repeat history with the launch of its Le Max 2, which is expected to be running Snapdragon 820, Qualcomm’s upcoming high-end chipset.
According to a source, Le Max will not only feature different hardware, but will also sport a beautiful body in order to target both sets of customers that require a smartphone with a very attractive design, and with one that features impressive hardware specifications. If Snapdragon 820 is going to be present in Le Max 2, then users will be able to take advantage of Qualcomm’s Quick Charge 3.0 feature. This feature will charge smartphones from 0 to 80 percent in just 35 minutes, but it might take longer for the upcoming smartphone since it could very well possess a large battery when it is officially announced.
Coming to the body of Le Max 2, the source reveals that the phone is most likely going to feature a double glass design, which will increase the overall looks of the smartphone. However, we are not too sure how durable the smartphone will be if the company decides to use this particular form of material. There are two more images revealing what the rear side of the smartphone will look like.
In total, there are four holes, which makes it really confusing as to which component is going to cover the surrounding of it. The larger hole present on the top right corner will most likely accommodate the high megapixel camera sensor, while the hole next to it will most likely accommodate a flash. Furthermore, the smallest hole could feature a microphone while the very large one in the center could be where the fingerprint scanner is going to be placed.
Looking at all these features, we cannot expect Le Max 2 to be a cheaply priced phone, but at this current point, we do not have any pricing details.