Although it is believed that Huawei is about to announce its new flagship device on September 1, the details given by one of its official in a Chinese site, it is just going to be an upgrade to the Mate S smartphone. Besides that, Mate 9 which everyone is looking forward to is expected to be released around November this year.
Secretary General of the League, old Yao broke the news on Weibo, Huawei Hass Unicorn 970 is the TSMC 10nm process first verdict chip. However, MediaTek X30 (MT6799) catch up later, it is estimated produce earlier than Unicorn 970.
In addition, old Yao also emphasized on Weibo that Kirin 970 will be used in the Mate 9.
Also, note that the construction of 12-inch wafer plant and a design service center which invest by the TSMC in Nanjing will be officially started tomorrow. The wafer plant planned monthly capacity of 20,000 12-inch wafers and is expected to begin production of a 16-nanometer process in the second half of 2018. The chairman of TSMC Nanjing plant announced that the world’s leading wafer technology will enter the China mainland, it also means that battle of the advanced process in domestic IC industry has officially started.
However, we doubt if Mate 9 will bring substantial change in the design elements in the phone as compared to its predecessors.