Xiaomi Civi 3 Appeared On Geekbench With Dimensity 8200 SoC
Xiaomi recently made an official announcement regarding their upcoming smartphone, the Xiaomi Civi 3. This device will be the world’s first to feature the Dimensity 8200-Ultra chip developed by MediaTek. The Dimensity 8200-Ultra chip has been specifically customized for the Xiaomi Civi 3, delivering improved image quality and overall performance.
The existence of the Xiaomi Civi 3 was discovered in the Geekbench database under the model number 23046PNC9C and the code name “Yuechu.” The benchmark results indicate that the phone will be powered by the MediaTek Dimensity 8200 Ultra SoC, accompanied by 12GB of RAM. Furthermore, the device will come pre-installed with the MIUI system, which is based on Android 13.
In terms of performance
The Xiaomi Civi 3 achieved a single-core test score of 1148 points and a multi-core test score of 3356 points on Geekbench 6. These scores slightly surpass those of other smartphones, such as the OnePlus 10R and realme GT Neo 3, both equipped with the Dimensity 8100 Ultra chip.
Leaks and rumors suggest that the Xiaomi Civi 3 will feature a 5G inter-network roaming function, enabling users to access 5G networks from different operators without the need to change their SIM card. This means that if you have a telecom card but are in an area without telecom 5G coverage, the phone will prioritize connecting to mobile 5G networks if available.
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Furthermore, a reliable source disclosed additional information about the Xiaomi Civi 3. The phone will sport a front-facing dual-camera setup, with both cameras featuring 32MP Samsung S5KGD2 sensors. On the rear, the device will house a Sony IMX800 main camera with optical image stabilization (OIS). The screen will support a high refresh rate of 120Hz, and the device will come with a built-in 4500mAh battery that supports 67W fast charging.
Source: IThome
