NewsReviews

Xiaomi Mi 11 Dismantled: Tested temp. of Snapdragon 888

Yesterday, On December 28, 2020, Xiaomi released the new flagship smartphone Xiaomi Mi 11 in China. Xiaomi Mi 11 is the first smartphone with Qualcomm Snapdragon 888 chip. Today, the Xiaomi flagship smartphone is quickly dismantled, here Xiaomi Today have brought you the detailed version of Xiaomi Mi 11 Dismantled.

Table of Contents

Xiaomi MI 11 Dismantling:

Today, On December 29, 2020, the new flagship smartphone is dismantled by IAO technology. If you are familiar with the dismantling, this dismantling starts with removing sim-tray, which is place at the bottom of the smartphone. Now to open the pry, the bottom’s glue is to open from the leather back shell. Now to remove the camera sensor cover, you need to unscrew the screw on the cover.

Editor’S Choice:

Xiaomi Wemax One pro, Best 700 ANSI Lumens projector for $1399.99

5 MP Samsung S5K5E9

Camera

Opening the camera, Xiaomi Today learns the smartphone’s primary camera is 108 MP, which is Samsung’s ISOCELL HMX. The camera supports the OIS function. With this 108 MP camera, the primary camera is pair with the 5 MP Samsung S5K5E9. Along with this the 13 MP ultra-wide-angle module is OmniVision’s CMOSOV13B10. The glass of the primary camera covers CNC processing. The macro lens adopts the cover glass. This glass cover puts forward the higher requirements on the optical performance and flatness of the glass cover. This makes the processing difficulty higher.

Xiaomi MI 11

Motherboard:

Coming to the motherboard, the motherboard is cover with the VC heat sinks and copper, foil, graphite, aerogel, and thermal oil. These all components are to ensure the heat dissipation performance of the mobile phone. The Snapdragon 888 SOC and flash memory are seal with glue, which can further improve the phone’s safety when dropped or in water.

Xiaomi MI 11

Battery:

Mi 11 comes with a BM4X lithium polymer battery with a capacity of 4600 mAh, produce by Xinwangda Electronics Co., Ltd.

The video also tested the heat dissipation performance of the mobile phone. Playing “PUBG Mobile” for 30 minutes under HDR high-definition 60Hz, the maximum temperature of the mobile phone’s front is about 41?, and the maximum of the back of the mobile phone is about 40?. When playing “The Original God”, in the highest quality, the highest temperature reached 37°C after 1 hour. It seems that Snapdragon 888 generates a lot of heat. If all heat dissipation materials such as copper foil and metal shield are remove, this SoC can easily reach above 80°C. Xiaomi Mi 11 has done an excellent job in temperature control.

Must Read:

Xiaomi MI 11 Detailed review and Xiaomi MI 10th Anniversary explained

Leave a Reply

Your email address will not be published.

Back to top button